tmtech implemented an innovative design techniques and using advanced CMOS technology processes also result in its products having smaller die sizes than those of competing products. One benefit of a smaller die size is the significant increase in manufacturing yields. Equally important is the fact that small die size results in lower die costs, increased speed, and lower power consumption.
Furthermore, the company has developed an extensive library of memory design modules that are scaleable in size and can be used as building blocks for new products, resulting in shorter design cycles. This design strategy enables tmtech improve the performance, yield, and cost advantage of its basic designs and sustain them in successive generations of higher density, higher performance, and higher quality products.
Since the early year's, tmtech has continually led the way in advancing its CMOS process technology to lower line widths. Currently, tmtech utilizes line widths as narrow as 0.25 microns. In the future, tmtech will use 0.21 and 0.18 micron technologies and leverages this strength to form partnerships with the world¡¦s leading wafer foundries that use SRAMs & DRAMs to drive their advances in process technologies development.